TY  - CONF
AU  - Belavič, Darko
AU  - Vojisavljević, Katarina
AU  - Kuscer, Danjela
AU  - Pečnik, Tanja
AU  - Zając, Jerzy
AU  - Anghelescu, Adrian
AU  - Muscalu, George
AU  - Hodnik, Marjan
AU  - Kos, Tomaž
AU  - Drnovšek, Silvo
AU  - Malic, Barbara
PY  - 2017
UR  - http://rimsi.imsi.bg.ac.rs/handle/123456789/2565
AB  - In the contributionthe design and the fabrication of two different types of ceramic packaging for PiezoMEMS devices ispresented. The first ceramic packaging is designed for housing the piezoelectric energy harvester. This packaging is made using LTCC technology and in the final application willintegrate piezoelectric device, electroniccircuit, storage capacitor and other components into the complex microsystem. The second packaging is developed for piezoelectric vibrating device as a part of water-purification system. In this case,the thick-film technology is used for electrical interconnection of piezoelectric actuators and for the hermetic watertight insulation of the system.
C3  - 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition
T1  - Ceramic packaging of PiezoMEMS devices
EP  - 4
IS  - 17732550
SP  - 1
DO  - 10.23919/EMPC.2017.8346888
ER  - 

@conference{
author = "Belavič, Darko and Vojisavljević, Katarina and Kuscer, Danjela and Pečnik, Tanja and Zając, Jerzy and Anghelescu, Adrian and Muscalu, George and Hodnik, Marjan and Kos, Tomaž and Drnovšek, Silvo and Malic, Barbara",
year = "2017",
abstract = "In the contributionthe design and the fabrication of two different types of ceramic packaging for PiezoMEMS devices ispresented. The first ceramic packaging is designed for housing the piezoelectric energy harvester. This packaging is made using LTCC technology and in the final application willintegrate piezoelectric device, electroniccircuit, storage capacitor and other components into the complex microsystem. The second packaging is developed for piezoelectric vibrating device as a part of water-purification system. In this case,the thick-film technology is used for electrical interconnection of piezoelectric actuators and for the hermetic watertight insulation of the system.",
journal = "21st European Microelectronics and Packaging Conference (EMPC) & Exhibition",
title = "Ceramic packaging of PiezoMEMS devices",
pages = "4-1",
number = "17732550",
doi = "10.23919/EMPC.2017.8346888"
}

Belavič, D., Vojisavljević, K., Kuscer, D., Pečnik, T., Zając, J., Anghelescu, A., Muscalu, G., Hodnik, M., Kos, T., Drnovšek, S.,& Malic, B.. (2017). Ceramic packaging of PiezoMEMS devices. in 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition(17732550), 1-4.
https://doi.org/10.23919/EMPC.2017.8346888

Belavič D, Vojisavljević K, Kuscer D, Pečnik T, Zając J, Anghelescu A, Muscalu G, Hodnik M, Kos T, Drnovšek S, Malic B. Ceramic packaging of PiezoMEMS devices. in 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition. 2017;(17732550):1-4.
doi:10.23919/EMPC.2017.8346888 .

Belavič, Darko, Vojisavljević, Katarina, Kuscer, Danjela, Pečnik, Tanja, Zając, Jerzy, Anghelescu, Adrian, Muscalu, George, Hodnik, Marjan, Kos, Tomaž, Drnovšek, Silvo, Malic, Barbara, "Ceramic packaging of PiezoMEMS devices" in 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition, no. 17732550 (2017):1-4,
https://doi.org/10.23919/EMPC.2017.8346888 . .