Ceramic packaging of PiezoMEMS devices
Аутори
Belavič, DarkoVojisavljević, Katarina
Kuscer, Danjela
Pečnik, Tanja
Zając, Jerzy
Anghelescu, Adrian
Muscalu, George
Hodnik, Marjan
Kos, Tomaž
Drnovšek, Silvo
Malic, Barbara
Конференцијски прилог (Објављена верзија)
Метаподаци
Приказ свих података о документуАпстракт
In the contributionthe design and the fabrication of two different types of ceramic packaging for PiezoMEMS devices ispresented. The first ceramic packaging is designed for housing the piezoelectric energy harvester. This packaging is made using LTCC technology and in the final application willintegrate piezoelectric device, electroniccircuit, storage capacitor and other components into the complex microsystem. The second packaging is developed for piezoelectric vibrating device as a part of water-purification system. In this case,the thick-film technology is used for electrical interconnection of piezoelectric actuators and for the hermetic watertight insulation of the system.
Кључне речи:
ceramic packaging / MEMS / piezoelectric / LTCC / thick filmИзвор:
21st European Microelectronics and Packaging Conference (EMPC) & Exhibition, 2017, 17732550, 1-4Финансирање / пројекти:
- Slovenian Research Agency (research core funding No. P2-0105)
- M-ERA.NET consortium of Agencies and Ministries from Slovenia, Romania and Poland
Институција/група
Institut za multidisciplinarna istraživanjaTY - CONF AU - Belavič, Darko AU - Vojisavljević, Katarina AU - Kuscer, Danjela AU - Pečnik, Tanja AU - Zając, Jerzy AU - Anghelescu, Adrian AU - Muscalu, George AU - Hodnik, Marjan AU - Kos, Tomaž AU - Drnovšek, Silvo AU - Malic, Barbara PY - 2017 UR - http://rimsi.imsi.bg.ac.rs/handle/123456789/2565 AB - In the contributionthe design and the fabrication of two different types of ceramic packaging for PiezoMEMS devices ispresented. The first ceramic packaging is designed for housing the piezoelectric energy harvester. This packaging is made using LTCC technology and in the final application willintegrate piezoelectric device, electroniccircuit, storage capacitor and other components into the complex microsystem. The second packaging is developed for piezoelectric vibrating device as a part of water-purification system. In this case,the thick-film technology is used for electrical interconnection of piezoelectric actuators and for the hermetic watertight insulation of the system. C3 - 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition T1 - Ceramic packaging of PiezoMEMS devices EP - 4 IS - 17732550 SP - 1 DO - 10.23919/EMPC.2017.8346888 ER -
@conference{ author = "Belavič, Darko and Vojisavljević, Katarina and Kuscer, Danjela and Pečnik, Tanja and Zając, Jerzy and Anghelescu, Adrian and Muscalu, George and Hodnik, Marjan and Kos, Tomaž and Drnovšek, Silvo and Malic, Barbara", year = "2017", abstract = "In the contributionthe design and the fabrication of two different types of ceramic packaging for PiezoMEMS devices ispresented. The first ceramic packaging is designed for housing the piezoelectric energy harvester. This packaging is made using LTCC technology and in the final application willintegrate piezoelectric device, electroniccircuit, storage capacitor and other components into the complex microsystem. The second packaging is developed for piezoelectric vibrating device as a part of water-purification system. In this case,the thick-film technology is used for electrical interconnection of piezoelectric actuators and for the hermetic watertight insulation of the system.", journal = "21st European Microelectronics and Packaging Conference (EMPC) & Exhibition", title = "Ceramic packaging of PiezoMEMS devices", pages = "4-1", number = "17732550", doi = "10.23919/EMPC.2017.8346888" }
Belavič, D., Vojisavljević, K., Kuscer, D., Pečnik, T., Zając, J., Anghelescu, A., Muscalu, G., Hodnik, M., Kos, T., Drnovšek, S.,& Malic, B.. (2017). Ceramic packaging of PiezoMEMS devices. in 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition(17732550), 1-4. https://doi.org/10.23919/EMPC.2017.8346888
Belavič D, Vojisavljević K, Kuscer D, Pečnik T, Zając J, Anghelescu A, Muscalu G, Hodnik M, Kos T, Drnovšek S, Malic B. Ceramic packaging of PiezoMEMS devices. in 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition. 2017;(17732550):1-4. doi:10.23919/EMPC.2017.8346888 .
Belavič, Darko, Vojisavljević, Katarina, Kuscer, Danjela, Pečnik, Tanja, Zając, Jerzy, Anghelescu, Adrian, Muscalu, George, Hodnik, Marjan, Kos, Tomaž, Drnovšek, Silvo, Malic, Barbara, "Ceramic packaging of PiezoMEMS devices" in 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition, no. 17732550 (2017):1-4, https://doi.org/10.23919/EMPC.2017.8346888 . .