A simple ball milling/thermal treatment procedure was applied to obtain fine thermistor powders. Three different powder compositions were analyzed-Cu0.2Ni0.5Zn1.0Mn1.3O4, Cu0.25Ni0.5Zn1.0Mn1.25O4 and Cu0.4Ni0.5Mn2.1O4. XRD analysis showed that all three powder compositions had a cubic spinel structure. Correlation between the sintering temperature, structure and resulting electrical properties was analyzed on bulk samples. Thick film pastes were composed and segmented thick film thermistors were screen printed on alumina, dried and fired. SEM analysis revealed a typical dendrite structure with small grains and a developed surface area. Thick film sheet resistance was measured on a test matrix and the resistance decreased with increasing Cu content. The temperature dependence of sample resistance was measured in a climatic chamber enabling calculation of the material constant and activation energy. Aging of the obtained segmented thermistors was analyzed and the resistivity drift was 0....23% for the Cu0.2Ni0.5Zn1.0Mn1.3O4 NTC thick film thermistor confirming greater stability of thermistors containing Zn and Cu that in combination with the determined good thermistor characteristics make them good candidates for temperature and heat loss sensor applications.
Keywords:
Thick film thermistor / NTC ceramic material / Electrical properties / Ball milling / Aging
TY - JOUR
AU - Aleksić, Obrad
AU - Nikolić, Maria Vesna
AU - Luković, Miloljub
AU - Nikolić, Nenad
AU - Radojcic, Branka M
AU - Radovanović, M
AU - Vasiljević, Zorka Z
AU - Mitric, Miodrag
AU - Nikolić, Pantelija M.
PY - 2013
UR - http://rimsi.imsi.bg.ac.rs/handle/123456789/717
AB - A simple ball milling/thermal treatment procedure was applied to obtain fine thermistor powders. Three different powder compositions were analyzed-Cu0.2Ni0.5Zn1.0Mn1.3O4, Cu0.25Ni0.5Zn1.0Mn1.25O4 and Cu0.4Ni0.5Mn2.1O4. XRD analysis showed that all three powder compositions had a cubic spinel structure. Correlation between the sintering temperature, structure and resulting electrical properties was analyzed on bulk samples. Thick film pastes were composed and segmented thick film thermistors were screen printed on alumina, dried and fired. SEM analysis revealed a typical dendrite structure with small grains and a developed surface area. Thick film sheet resistance was measured on a test matrix and the resistance decreased with increasing Cu content. The temperature dependence of sample resistance was measured in a climatic chamber enabling calculation of the material constant and activation energy. Aging of the obtained segmented thermistors was analyzed and the resistivity drift was 0.23% for the Cu0.2Ni0.5Zn1.0Mn1.3O4 NTC thick film thermistor confirming greater stability of thermistors containing Zn and Cu that in combination with the determined good thermistor characteristics make them good candidates for temperature and heat loss sensor applications.
PB - Elsevier, Amsterdam
T2 - Materials Science and Engineering B-Advanced Functional Solid-State Materials
T1 - Preparation and characterization of Cu and Zn modified nickel manganite NTC powders and thick film thermistors
EP - 210
IS - 3
SP - 202
VL - 178
DO - 10.1016/j.mseb.2012.11.003
ER -
@article{
author = "Aleksić, Obrad and Nikolić, Maria Vesna and Luković, Miloljub and Nikolić, Nenad and Radojcic, Branka M and Radovanović, M and Vasiljević, Zorka Z and Mitric, Miodrag and Nikolić, Pantelija M.",
year = "2013",
abstract = "A simple ball milling/thermal treatment procedure was applied to obtain fine thermistor powders. Three different powder compositions were analyzed-Cu0.2Ni0.5Zn1.0Mn1.3O4, Cu0.25Ni0.5Zn1.0Mn1.25O4 and Cu0.4Ni0.5Mn2.1O4. XRD analysis showed that all three powder compositions had a cubic spinel structure. Correlation between the sintering temperature, structure and resulting electrical properties was analyzed on bulk samples. Thick film pastes were composed and segmented thick film thermistors were screen printed on alumina, dried and fired. SEM analysis revealed a typical dendrite structure with small grains and a developed surface area. Thick film sheet resistance was measured on a test matrix and the resistance decreased with increasing Cu content. The temperature dependence of sample resistance was measured in a climatic chamber enabling calculation of the material constant and activation energy. Aging of the obtained segmented thermistors was analyzed and the resistivity drift was 0.23% for the Cu0.2Ni0.5Zn1.0Mn1.3O4 NTC thick film thermistor confirming greater stability of thermistors containing Zn and Cu that in combination with the determined good thermistor characteristics make them good candidates for temperature and heat loss sensor applications.",
publisher = "Elsevier, Amsterdam",
journal = "Materials Science and Engineering B-Advanced Functional Solid-State Materials",
title = "Preparation and characterization of Cu and Zn modified nickel manganite NTC powders and thick film thermistors",
pages = "210-202",
number = "3",
volume = "178",
doi = "10.1016/j.mseb.2012.11.003"
}
Aleksić, O., Nikolić, M. V., Luković, M., Nikolić, N., Radojcic, B. M., Radovanović, M., Vasiljević, Z. Z., Mitric, M.,& Nikolić, P. M.. (2013). Preparation and characterization of Cu and Zn modified nickel manganite NTC powders and thick film thermistors. in Materials Science and Engineering B-Advanced Functional Solid-State Materials
Elsevier, Amsterdam., 178(3), 202-210.
https://doi.org/10.1016/j.mseb.2012.11.003
Aleksić O, Nikolić MV, Luković M, Nikolić N, Radojcic BM, Radovanović M, Vasiljević ZZ, Mitric M, Nikolić PM. Preparation and characterization of Cu and Zn modified nickel manganite NTC powders and thick film thermistors. in Materials Science and Engineering B-Advanced Functional Solid-State Materials. 2013;178(3):202-210.
doi:10.1016/j.mseb.2012.11.003 .
Aleksić, Obrad, Nikolić, Maria Vesna, Luković, Miloljub, Nikolić, Nenad, Radojcic, Branka M, Radovanović, M, Vasiljević, Zorka Z, Mitric, Miodrag, Nikolić, Pantelija M., "Preparation and characterization of Cu and Zn modified nickel manganite NTC powders and thick film thermistors" in Materials Science and Engineering B-Advanced Functional Solid-State Materials, 178, no. 3 (2013):202-210,
https://doi.org/10.1016/j.mseb.2012.11.003 . .
