Ceramic packaging of PiezoMEMS devices

Abstract

In the contributionthe design and the fabrication of two different types of ceramic packaging for PiezoMEMS devices ispresented. The first ceramic packaging is designed for housing the piezoelectric energy harvester. This packaging is made using LTCC technology and in the final application willintegrate piezoelectric device, electroniccircuit, storage capacitor and other components into the complex microsystem. The second packaging is developed for piezoelectric vibrating device as a part of water-purification system. In this case,the thick-film technology is used for electrical interconnection of piezoelectric actuators and for the hermetic watertight insulation of the system.