Приказ основних података о документу

dc.creatorMaric, Viktor
dc.creatorLuković, Miloljub
dc.creatorŽivanov, Ljiljana D
dc.creatorAleksić, Obrad
dc.creatorMenicanin, Aleksandar
dc.date.accessioned2022-04-05T14:17:06Z
dc.date.available2022-04-05T14:17:06Z
dc.date.issued2008
dc.identifier.issn0018-9456
dc.identifier.urihttp://rimsi.imsi.bg.ac.rs/handle/123456789/280
dc.description.abstractIn this paper, an alternative approach to the analysis of thick-film segmented negative temperature coefficient thermistors based on the use of a commercial electromagnetic simulator tool is presented. The influence of the geometrical parameters and material characteristics of the used thermistor paste on the overall thermistor performance was analyzed and simulated. A physical model for the segmented thermistors is given in brief, together with experimental data. The diffusion of electrode metal into the thermistor layer was analyzed, simulated, and estimated. Obtained simulation results were compared with experimental results, and the validity of the adopted approach was verified.en
dc.publisherIEEE-Inst Electrical Electronics Engineers Inc, Piscataway
dc.rightsrestrictedAccess
dc.sourceIEEE Transactions on Instrumentation and Measurement
dc.subjectthick filmen
dc.subjectthermistoren
dc.subjectnegative temperature coefficient (NTC)en
dc.subjectlayer thicknessen
dc.subjectelectromagnetic (EM) simulatoren
dc.subjectdiffusionen
dc.subjectdielectric permittivityen
dc.subjectBulk conductivityen
dc.titleEM Simulator Analysis of Optimal Performance Thick-Film Segmented Thermistors versus Material Characteristics Selectionen
dc.typearticle
dc.rights.licenseARR
dc.citation.epage2575
dc.citation.issue11
dc.citation.other57(11): 2568-2575
dc.citation.rankM22
dc.citation.spage2568
dc.citation.volume57
dc.identifier.doi10.1109/TIM.2008.925017
dc.identifier.scopus2-s2.0-54949093563
dc.identifier.wos000260463500024
dc.type.versionpublishedVersion


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